发明名称 |
Chemical mechanical polishing pad |
摘要 |
A chemical mechanical polishing pad used for chemical mechanical polishing comprises a polishing surface, a non-polishing surface that is provided opposite to the polishing surface, a side surface that connects an outer edge of the polishing surface and an outer edge of the non-polishing surface, and a plurality of grooves formed in the polishing surface. The side surface has a slope surface that is connected to the polishing surface, and a depth of the grooves is equal to or smaller than a height of the slope surface. |
申请公布号 |
US8128464(B2) |
申请公布日期 |
2012.03.06 |
申请号 |
US20090360967 |
申请日期 |
2009.01.28 |
申请人 |
MOTONARI MASAYUKI;UENO TOMIKAZU;YAMAMOTO MASAHIRO;TAI YUUGO;MIYAUCHI HIROYUKI;JSR CORPORATION |
发明人 |
MOTONARI MASAYUKI;UENO TOMIKAZU;YAMAMOTO MASAHIRO;TAI YUUGO;MIYAUCHI HIROYUKI |
分类号 |
B24D11/00;B24B37/20;B24B37/26;H01L21/304 |
主分类号 |
B24D11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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