发明名称 Reducing high-frequency signal loss in substrates
摘要 An integrated circuit structure includes a semiconductor substrate of a first conductivity type; and a depletion region in the semiconductor substrate. A deep well region is substantially enclosed by the depletion region, wherein the deep well region is of a second conductivity type opposite the first conductivity type. The depletion region includes a first portion directly over the deep well region and a second portion directly under the deep well region. An integrated circuit device is directly over the depletion region.
申请公布号 US8129817(B2) 申请公布日期 2012.03.06
申请号 US20080347208 申请日期 2008.12.31
申请人 JOU CHEWN-PU;CHEN HO-HSIANG;TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 JOU CHEWN-PU;CHEN HO-HSIANG
分类号 H01L21/70 主分类号 H01L21/70
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