发明名称 |
Component built-in wiring board |
摘要 |
A component built-in wiring board is provided. The component built-in wiring board 10 includes a core substrate 11, a first component 61, a first built-up layer 31 and a capacitor 101. The core substrate 11 has a housing hole 90 and the first component 61 is housed in the housing hole 90. A component mounting region 20 capable of mounting a second component 21 is provided in a surface 39 of the first built-up layer 31. The capacitor 101 has electrode layers 102 and 103 and a dielectric layer 104. The capacitor 101 is embedded in the first built-up layer 31 such that a first front surface 105 and a second front surface 106 in the electrode layer 102 and a first front surface 107 and a second front surface 108 in the electrode layer 103 are disposed in parallel with the surface 39 of the first built-up layer 31. |
申请公布号 |
US8130507(B2) |
申请公布日期 |
2012.03.06 |
申请号 |
US20090409143 |
申请日期 |
2009.03.23 |
申请人 |
ORIGUCHI MAKOTO;TAKASHIMA TSUNEAKI;NGK SPARK PLUG CO., LTD. |
发明人 |
ORIGUCHI MAKOTO;TAKASHIMA TSUNEAKI |
分类号 |
H05K7/00 |
主分类号 |
H05K7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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