发明名称 Pressure sensitive adhesive composition
摘要 The present invention has its object to provide a pressure sensitive adhesive composition which can be applied using no organic solvent and which manifests excellent pressure sensitive adhesion characteristics. This object can be achieved by a pressure sensitive adhesive composition which comprises, as essential constituents, the following: (A) a hydrolyzable silyl group-containing organic polymer containing at least 1.3 hydrolyzable silyl groups per molecule and having a number average molecular weight of 15,000 to 100,000; (B) a hydrolyzable silyl group-containing organic polymer containing 0.3 to 1.3 hydrolyzable silyl groups per molecule and having a number average molecular weight of 500 to 15,000; and (C) a tackifier resin.
申请公布号 US8129479(B2) 申请公布日期 2012.03.06
申请号 US20050586858 申请日期 2005.01.26
申请人 UEDA KAZUHIKO;IWAKIRI HIROSHI;KANEKA CORPORATION 发明人 UEDA KAZUHIKO;IWAKIRI HIROSHI
分类号 C08L83/00;B32B7/12;C08G65/336;C09J7/02;C09J11/06;C09J143/04;C09J171/00;C09J201/10 主分类号 C08L83/00
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