| 摘要 |
PURPOSE: A semiconductor package and a method of manufacturing the same are provided to increase radiation efficiency by extending a conductive lead frame. CONSTITUTION: A first semiconductor unit(200) comprises a first lead frame(210), a first semiconductor chip(220), and a first wire(230). The first semiconductor chip is mounted on a first die paddle(212) of the first lead frame. A second semiconductor unit(300) comprises a second lead frame(310), a second semiconductor chip(320), and a second wire(330). The second semiconductor chip is mounted on a second die paddle(312) of the second lead frame. A molding unit(400) molds the first semiconductor chip, a first wire, a second semiconductor chip, and the second wire. |
