BOARD FOR LED PACKAGE AND METHOD OF MANUFACTURE THE SAME

摘要

PURPOSE: A board for an LED package and a method of manufacture the same are provided to increase the production efficiency by performing a Roll-to-Roll process using a green sheet before sintering. CONSTITUTION: A junction layer is formed in a green sheet(a). A via hole is formed in the green sheet and the junction layer(b). A metal layer(240) is adhered to the metal layer(c). A plating layer is formed in the metal layer(d). The plating layer and the metal layer are patterned(e) An LTCC substrate is formed to perform heat treatment of the structure(f).