APPARATUS FOR CLEAVING BRITTLE MATERIALS BY USING THE PULSE LASER OF MULTI-FOCUSING METHOD

摘要

PURPOSE: A device for cutting brittle materials with multi-focusing pulse lasers is provided to reduce damage to a target by heat or shock wave due to high-output laser beam since the high-output laser beam is multiplied. CONSTITUTION: A device for cutting brittle materials with multi-focusing pulse lasers comprises a laser generator, a plurality of paths, a guide unit(150), and a focusing unit(160). At least one of the paths has a different length from one of remaining paths. The guide unit splits a laser beam into a plurality of laser beams to pass the paths, collects the split beams and guides the beams to a specific path. The focusing unit focuses the split beams guided and irradiates a plurality of regions between the front and rear surfaces of a target. The guide unit comprises a time adjusting module and a divergent-angle change module. The time adjusting module varies the length of one or more of the paths.