发明名称 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor device having a MPS structure or a JBS structure, capable of maintaining both of low forward drop voltage VF and high reverse breakdown voltage VR, and having short reverse recovery time trr and low reverse leakage current IR. <P>SOLUTION: A semiconductor device 100 comprises: an n<SP POS="POST">-</SP>type semiconductor layer 114; p<SP POS="POST">+</SP>type diffusion regions 120 that are selectively formed on the surface of the n<SP POS="POST">-</SP>type semiconductor layer 114; an electrode layer composed of a barrier metal layer 130 that is formed on the surface of the n<SP POS="POST">-</SP>type semiconductor layer 114 and the p<SP POS="POST">+</SP>type diffusion regions 120, forms a Schottky junction with the n<SP POS="POST">-</SP>type semiconductor layer 114, and forms an ohmic junction with the p<SP POS="POST">+</SP>type diffusion regions 120; and local lifetime-control regions 160 in which lifetime killers are introduced into only the regions directly under the p<SP POS="POST">+</SP>type diffusion regions 120. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012044005(A) 申请公布日期 2012.03.01
申请号 JP20100184478 申请日期 2010.08.19
申请人 SHINDENGEN ELECTRIC MFG CO LTD 发明人 MATSUZAKI KINSHI
分类号 H01L29/47;H01L29/872 主分类号 H01L29/47
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