| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an imaging device and imaging system that reduce a possibility of the deformation or cracks of a semiconductor substrate, and that have a high reliability. <P>SOLUTION: An imaging device has: a transparent member; an imaging element chip with a photodiode; and a fixing member arranged around the imaging element chip, and that fixes the transparent member and the imaging element chip. A space surrounded by the transparent member and the imaging element chip is provided. The imaging element chip has a semiconductor substrate. The semiconductor substrate has a through electrode that penetrates a first main surface on the transparent member side and a second main surface on an opposite side of the first main surface. The through electrode is arranged in a fixed region corresponding to the fixing member when the imaging device is seen from the transparent member side. A borderline having a thickness less than that of the semiconductor substrate in a first region corresponding to the space is arranged in the fixed region. <P>COPYRIGHT: (C)2012,JPO&INPIT |
