CIRCUIT CONNECTING MATERIAL, CONNECTING METHOD USING THE SAME, AND CONNECTION STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a circuit connecting material that exhibits excellent connection reliability by improving adhesion to an interface with a silicon nitride film when subjected to high temperature and high humidity processing.

SOLUTION: The circuit connecting material contains (1) a multifunctional (meth)acrylate monomer, (2) a radical polymerization initiator which generates a free radical by heat or light, and (3) a monofunctional (meth)acrylate monomer, wherein the monofunctional (meth)acrylate monomer has a biphenyl group or a naphthalene group, and the bonding position of an oxygen atom bonded to the biphenyl group or the naphthalene group is ortho, meta, or para position.

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