发明名称 |
LATERAL CONNECTION FOR A VIA-LESS THIN FILM RESISTOR |
摘要 |
The present disclosure is directed to an integrated circuit having a substrate and a first and a second interconnect structure over the substrate. Each interconnect structure has a first conductive layer over the substrate and a second conductive layer over the first conductive layer. The integrated circuit also includes a thin film resistor over a portion of the substrate between the first and the second interconnect structure that electrically connects the first conductive layers of the first and second interconnect structures.
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申请公布号 |
US2012049323(A1) |
申请公布日期 |
2012.03.01 |
申请号 |
US20100862589 |
申请日期 |
2010.08.24 |
申请人 |
NG HUI CHONG VINCE;LE NEEL OLIVIER;LEUNG CALVIN;STMICROELECTRONICS ASIA PACIFIC PTE LTD. |
发明人 |
NG HUI CHONG VINCE;LE NEEL OLIVIER;LEUNG CALVIN |
分类号 |
H01L27/06;H01L21/02 |
主分类号 |
H01L27/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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