SEMICONDUCTOR CHIP ASSEMBLY AND METHOD OF PREPARING THE SAME
摘要
A semiconductor chip assembly and a method for forming the same are provided. The semiconductor chip assembly comprises: a semiconductor chip (20), a substrate (10), a first layer (203) formed on a surface of the substrate (10), in which one of the first layer (203) and the second layer (204) has an opening (205) therein; and a second layer (204) formed on a surface of the semiconductor chip (20) and connected to the first layer (203) by eutectic bonding.
申请公布号
WO2012025024(A1)
申请公布日期
2012.03.01
申请号
WO2011CN78491
申请日期
2011.08.16
申请人
BYD COMPANY LIMITED;LIU, YINGCE;HUO, DONGMING;SUN, TIANBAO