发明名称 |
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES |
摘要 |
According to one embodiment, a method is disclosed for manufacturing a semiconductor device including a semiconductor chip having electrode pads formed on a first major surface and a bonding layer provided on a second major surface, and a substrate having the semiconductor chip mounted on the substrate. The manufacturing method can include applying a fillet-forming material to a portion contacting an outer edge of the second major surface of the semiconductor chip on a front face of the substrate. The method can include bonding the second major surface of the semiconductor chip to the substrate via the bonding layer. |
申请公布号 |
US2012052627(A1) |
申请公布日期 |
2012.03.01 |
申请号 |
US201113052144 |
申请日期 |
2011.03.21 |
申请人 |
KATAMURA YUKIO;TANE YASUO;YOSHIMURA ATSUSHI;IWAMI FUMIHIRO;KABUSHIKI KAISHA TOSHIBA |
发明人 |
KATAMURA YUKIO;TANE YASUO;YOSHIMURA ATSUSHI;IWAMI FUMIHIRO |
分类号 |
H01L21/50 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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