| 摘要 |
<P>PROBLEM TO BE SOLVED: To dielectrically embed components without allowing unnecessary forces to act thereon, and without the need to guide a foil into a route in advance. <P>SOLUTION: A method which embeds at least one component into a dielectric layer 106 is provided and comprises the steps of: a) positioning and affixing the at least one component on a carrier; b) casting a liquid dielectric around the at least one component, thereby enclosing the at least one component completely; c) hardening the liquid dielectric to form a solid dielectric layer 106; and d) applying, in particular by lamination thereon, another layer 105, in particular an electrically conductive layer 117. In addition, the use of the dielectric layer 106 formed entirely of the liquid dielectric is provided, where the liquid dielectric is not converted into a solid state until the dielectric is processed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
