| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent temperature rise of a light-emitting element by providing a high heat dissipation layer, and to maintain high energy saving performance. <P>SOLUTION: The board with wiring is used for mounting a light-emitting element 50 thereon. The board with wiring comprises a metal support substrate 30, an insulation layer 20 provided on the metal support substrate 30, and a metal layer 10 provided on the insulation layer 20 in order to mount the light-emitting element 50. The board with wiring is provided with an opening O which penetrates the metal support substrate 30, the insulation layer 20 and the metal layer 10. The metal layer 10 has a wiring layer 11 functioning as an electrode, and a heat dissipation layer 12 formed separately from the wiring layer 11 and dissipates heat generated from the light-emitting element 50. <P>COPYRIGHT: (C)2012,JPO&INPIT |
