发明名称 |
SEMICONDUCTOR INTEGRATED CIRCUIT AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit and a semiconductor integrated circuit device which can stably supply power source voltage. <P>SOLUTION: In a semiconductor integrated circuit 40, a core circuit operating when a first power is supplied is formed on a core region on a surface of a semiconductor substrate and an I/O circuit operating when a second power is supplied is formed on an I/O region outside the core region on the surface of the semiconductor substrate The semiconductor integrated circuit 40 comprises a through via 51 supplying the first power in the semiconductor substrate so as to penetrate the semiconductor substrate and a pad 46 supplying the second power on the I/O region on the surface of the semiconductor substrate. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012044042(A) |
申请公布日期 |
2012.03.01 |
申请号 |
JP20100185069 |
申请日期 |
2010.08.20 |
申请人 |
KAWASAKI MICROELECTRONICS INC |
发明人 |
KIRYU HIROYOSHI |
分类号 |
H01L23/12;H01L21/822;H01L25/065;H01L25/07;H01L25/18;H01L27/04 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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