| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor module capable of reducing adverse effects to operation of a passive element due to resonance of a GND pattern, and to provide a surface-mounted component capable of being used for the semiconductor module. <P>SOLUTION: In a semiconductor module 10, a semiconductor device 2 to which a semiconductor circuit board 1 is flip-chip bonded is bonded to a surface-mounted substrate 3. The semiconductor device 2 includes a stack of, in that order, a first conductor layer 6, a first dielectric layer 7, a second conductor layer 8 forming a signal wiring pattern, and a second dielectric layer 9 on one surface 5a of a substrate 5. The second conductor layer 8 is electrically connected to the semiconductor circuit board 1 via first bumps 12. The semiconductor device 2 comprises a plurality of pad portions 13 on the first dielectric layer 7 or the second dielectric layer 9. Each pad portion 13 and the first conductor layer 6 are electrically connected by first conductor portions 14. A third conductor layer 4 provided on one surface 3a of the surface-mounted substrate 3 and the first conductor layer 6 are electrically connected via second bumps 15 disposed on each of the pad portions 13. <P>COPYRIGHT: (C)2012,JPO&INPIT |
