| 摘要 |
A process for the embodiment of electromagnetic radiation absorbers comprising the phases of manufacture of dies (16) embodied in modular component parts (17, 18, 19), Teflon covering of some surfaces of said die parts, assembly of the parts toform cavities (20) which reproduce the shapes of the absorbers (2), filling of the cavities (20) of the Teflon-coated dies (16) with a mixture consisting of the making up the absorbers (2), hardening in an oven of the mixture and subsequent disassembly of the dies (18) into their individual parts (17, 18, 19) to obtain the absorbers (2). The absorbers (2) made by the process which is the object of the present invention are used mainly in circuit modules operating in the microwave range. |
