| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device having a structure which can inhibit generation of air bubbles between a flame face and a lens and a manufacturing method of the same. <P>SOLUTION: The semiconductor device according to an embodiment comprises leads and a frame including a body part covering a part of the leads and provided with a recess part exposing another part of the leads. The frame further includes a frame part raised at an opening end of the recess part as a wall-like body surrounding the recess part with notches formed at a front edge. The semiconductor device further comprises an optical semiconductor element provided in the recess part and electrically connected to the leads, an encapsulation resin filled from the bottom of the recess part to a height reaching the frame part and covering the optical semiconductor element, and a lens bonded to the encapsulation resin. <P>COPYRIGHT: (C)2012,JPO&INPIT |
