| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board which prevents deformation and peeling of a wiring part caused by a difference in a temperature coefficient of expansion between the wiring part and a base film. <P>SOLUTION: The wiring board comprises a semiconductor substrate, a wiring part 4 provided on one surface of the semiconductor substrate and having a linearly extending region, a land part 5 provided on the one surface of the semiconductor substrate and connected to one end part of the region of the wiring part, and a protrusion part 6 provided on the one surface of the semiconductor substrate and locally formed from the land part in the same plane. <P>COPYRIGHT: (C)2012,JPO&INPIT |
