| 摘要 |
<P>PROBLEM TO BE SOLVED: To fix a semiconductor device not to shake when the semiconductor device is labeled using a labeling machine. <P>SOLUTION: A device fixing plate 4 is mounted on an IC tray 2 mounting a semiconductor device 3. When the device fixing plate 4 is mounted on the IC tray 2, a protrusion of the device fixing plate 4 enters the clearance between the IC tray 2 and the semiconductor device 3 thus correcting the position of the semiconductor device 3. Since the position of the semiconductor device 3 on the IC tray 2 is fixed, labeling position is not changed for every semiconductor device. <P>COPYRIGHT: (C)2012,JPO&INPIT |
