| 发明名称 |
LAMINATED WAFER INSPECTION METHOD |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laminated wafer inspection method which is capable of detecting a poorly laminated portion with sufficiently high accuracy. <P>SOLUTION: The laminated wafer inspection method for checking whether a laminated wafer has a poorly laminated portion or not includes: an ultrasonic inspection step of detecting a poorly laminated portion by using a reflected wave from the inside of the laminated wafer due to irradiation of an ultrasonic wave to the laminated wafer; and a peeling inspection step of pasting an adhesive tape to the laminated wafer after the execution of the ultrasonic inspection step and then peeling the adhesive tape to detect a poorly laminated portion. <P>COPYRIGHT: (C)2012,JPO&INPIT |
| 申请公布号 |
JP2012042431(A) |
申请公布日期 |
2012.03.01 |
| 申请号 |
JP20100186502 |
申请日期 |
2010.08.23 |
| 申请人 |
SUMCO CORP |
发明人 |
MORIKAWA YASUYUKI;YOSHIMARU KOJI |
| 分类号 |
G01N21/956;G01N19/04;G01N29/04;H01L21/02;H01L21/66;H01L27/12 |
主分类号 |
G01N21/956 |
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