| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a dividing method capable of cutting and dividing a ceramic substrate which is subjected to a hole-boring process and then is sintered, the dividing method cutting the sintered ceramic substrate along cutting-scheduled planes which connect between center axes of the bore holes with a high degree of accuracy. <P>SOLUTION: The dividing method includes: a step of forming a protective film 10 on a surface of the ceramic substrate 1 subjected to the hole-boring process and the sintering process; a subsequent step of imaging the surface side with an imaging unit 30 to detect a coordinate position of each of the holes 3 and store the coordinate positions as hole position information; and a further step of determining and storing the center coordinates 3A of the holes 3 based on the hole position information. The dividing method further includes: a step of calculating a linear function which connects center coordinates 3A of the holes 3 adjoining each other, with a straight line; and a step of performing the irradiation with a laser beam LB so as to successively connects the center coordinates 3A of the holes 3 adjoining each other, based on the linear function to perform ablation working, thereby dividing the ceramic substrate 1 into chips 7. <P>COPYRIGHT: (C)2012,JPO&INPIT |
