| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a device and a method for supplying slurry, capable of completely processing a wafer in processing even when a slurry supply engine runs down, as is the case in a double supply system without disposing any double supply system, and capable of processing the wafer without damaging the wafer in processing while reducing initial investment costs. <P>SOLUTION: The device and the method for supplying slurry includes: at least one slurry supply tank; a supply engine for supplying slurry to a CMP (Chemical Mechanical Polishing) device; a circulation line for supplying the slurry in the supply tank to the CMP device, to circulate it to the supply tank; a branch line for supplying the slurry in the circulation line to the CMP device; a valve disposed in the branch line; a buffer member connected to the branch line having a capacity to hold the slurry having amount sufficient to process a wafer set in the CMP device; and a pressure member for pressuring residual slurry in the buffer member when the supply engine stops to supply it to the CMP device. <P>COPYRIGHT: (C)2012,JPO&INPIT |
