| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heating and cooling device capable of executing the batch processing, improving the throughput, and performing the miniaturization and the energy saving. <P>SOLUTION: The heating and cooling device includes: a plurality of substrate storage chambers 23, 35 which are non-communicated with each other; and a heating/cooling control unit 50 for introducing heating gas or cooling gas in the plurality of substrate storage chambers. The heating and cooling device is capable of individually controlling the temperature in each of the plurality of substrate storage chambers. <P>COPYRIGHT: (C)2012,JPO&INPIT |
