| 摘要 |
A semiconductor apparatus in a preferred embodiment includes: a substrate; a first chip provided on the substrate; a solder bump formed on the first chip; a solder dam arranged in substantially a rectangular and annular manner outside around the solder bump on the first chip by alternately connecting four sides and four quarter or less arcs; an electrode pad placed outside of the solder dam in the first chip; a second chip provided on the first chip in electric connection to the first chip via the solder bump; and an under-fill material filling a clearance between the first chip and the second chip inside of the solder dam. Here, a difference between an inner diameter and an outer diameter of the arc is 60 μm or more whereas the center radius of the arc is greater than 207.5 μm.
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