| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a terminal structure and an electronic device which are capable of achieving sufficiently excellent drop strength even when an impact in a vertical or horizontal direction is applied to a connection surface of a substrate. <P>SOLUTION: An electronic device 300 is provided with a terminal structure 14. The terminal structure 14 comprises: a terminal 12 in which a conductor layer 40 containing at least one kind of metal selected from gold, silver, and copper, a first layer 52 containing nickel and phosphorus on the conductor layer, a second layer 54 having a lower atomic ratio of nickel to phosphorus than the first layer and containing Ni<SB POS="POST">3</SB>P on the first layer, a third layer 56 containing a Ni-P-Sn-based first intermetallic compound on the second layer, and a fourth layer 58 containing a Ni-Cu-Sn-based second intermetallic compound are laminated in this order; and a solder layer 75 laminated on the fourth layer of the terminal. When a surface roughness of the third layer on the second layer side is Ra1 and a surface roughness of the third layer on the fourth layer side is Ra2, Ra2 is greater than Ra1. <P>COPYRIGHT: (C)2012,JPO&INPIT |
