发明名称 |
CURABLE RESIN COMPOSITION AND MOLDING |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a curable resin composition which has optical characteristics, heat resistance and high moldability. <P>SOLUTION: The curable resin composition comprises a polymer (P) including: a recurring unit (A) having a polymerizable unsaturated bond group; a recurring unit (B) having no polymerizable unsaturated bonds; and a recurring unit (C) having the main chain formed by a polymerizable group different from the polymerizable group composing the main chain of the recurring unit (B). <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012041371(A) |
申请公布日期 |
2012.03.01 |
申请号 |
JP20100180733 |
申请日期 |
2010.08.12 |
申请人 |
FUJIFILM CORP |
发明人 |
OKUTSU RIE;MOCHIZUKI HIROAKI;MOROOKA NAOYUKI;OBAYASHI TATSUHIKO |
分类号 |
C08F2/44;C08F265/06;G02B1/04 |
主分类号 |
C08F2/44 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|