发明名称 CURABLE RESIN COMPOSITION AND MOLDING
摘要 <P>PROBLEM TO BE SOLVED: To provide a curable resin composition which has optical characteristics, heat resistance and high moldability. <P>SOLUTION: The curable resin composition comprises a polymer (P) including: a recurring unit (A) having a polymerizable unsaturated bond group; a recurring unit (B) having no polymerizable unsaturated bonds; and a recurring unit (C) having the main chain formed by a polymerizable group different from the polymerizable group composing the main chain of the recurring unit (B). <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012041371(A) 申请公布日期 2012.03.01
申请号 JP20100180733 申请日期 2010.08.12
申请人 FUJIFILM CORP 发明人 OKUTSU RIE;MOCHIZUKI HIROAKI;MOROOKA NAOYUKI;OBAYASHI TATSUHIKO
分类号 C08F2/44;C08F265/06;G02B1/04 主分类号 C08F2/44
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