| 摘要 |
The present invention relates to a semiconductor device and a semiconductor process for making the same. The semiconductor device of the present invention includes a semiconductor substrate, at least one conductive via and at least one insulation ring. The semiconductor substrate has a first surface. The conductive via is disposed in the semiconductor substrate. Each conductive via has a conductor and an insulation wall disposed the peripheral of the conductor, and the conductive via is exposed on the first surface of the semiconductor substrate. The insulation ring is disposed the peripheral of the conductive via, and the depth of the insulation ring is smaller than that of the insulation wall. Since the insulation ring is disposed the peripheral of the conductive via, the insulation ring can protect the end of the conductive via from being damaged. Furthermore, the size of the insulation ring and the conductive via is larger than the conventional conductive via, the semiconductor device of the invention can utilize surface finish layer, RDL or UBM to easily connect the other semiconductor device. |
