| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring structure which is capable of making a good connection with an oxide electrode, suppressing mutual diffusion occurring at the interface with an insulating film or the like, and reducing costs in a manufacturing process, and to provide a semiconductor element, a wiring board, a display panel, and a display device each using this wiring structure. <P>SOLUTION: The wiring structure is a laminate composed of two or more layers including: one selected from a group consisting of an aluminum layer, a copper layer, and a copper alloy layer; and an aluminum alloy layer. The aluminum alloy layer is disposed on a surface layer of the laminate. Accordingly, in a liquid crystal display device or the like, an oxide film is not formed at a connection between the oxide electrode and wiring to allow good connection. <P>COPYRIGHT: (C)2012,JPO&INPIT |
