发明名称 CONNECTION METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a technology to connect objects to be connected each other in a vacuum chamber. <P>SOLUTION: In the connection method, the objects to be connected are connected each other by forming a connecting surface of the object to be connected which is surface-activated with a metal film by sputtering a metal onto at least one of the objects to be connected in the vacuum chamber to form the metal film, when the objects to be connected having the surface-activated connecting surfaces are to be connected each other. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012044188(A) 申请公布日期 2012.03.01
申请号 JP20110190438 申请日期 2011.09.01
申请人 BONDTECH INC;SUGA TADATOMO 发明人 YAMAUCHI AKIRA;SUGA TADATOMO
分类号 H01L21/02;B23K20/00;B23K20/24;C23C14/14;C23C14/34 主分类号 H01L21/02
代理机构 代理人
主权项
地址