| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wafer processing method which inhibits deterioration in processing quality of a wafer though bumps are formed and enables planarization. <P>SOLUTION: The processing method of cutting or polishing a rear face of a wafer whose front face has a bump-formed region on which a plurality of bumps are formed and a peripheral bump-unformed region surrounding the bump formed region, comprises: a preparation step of preparing a protection member having a circular concave part housing the plurality of bumps and having a depth substantially same as a height of the bump, and an annular convex part formed corresponding to the peripheral bump-unformed region so as to surround the circular concave part; a bump protection step of protecting the bumps on the wafer by housing the plurality of bumps in the circular concave part of the protection member while pasting the annular convex part of the protection member to the peripheral bump-unformed region; and a processing step of processing the rear face of the wafer by cutting means or polishing means by holding the wafer with a chuck table on the protection member side on which the protection member is pasted. <P>COPYRIGHT: (C)2012,JPO&INPIT |
