| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a cutting device capable of singly performing circumferential processing and linear processing on a wafer. <P>SOLUTION: A cutting device for performing linear processing and circumferential processing on a workpiece comprises: a chuck table 6 which holds the workpiece; a first spindle 28 which is driven for rotation; a first cutting blade 38 which is attached to the first spindle for performing the linear processing on the workpiece held by the chuck table; and a second cutting blade 34 which has a diameter smaller than that of the first cutting blade and is attached to the first spindle with a predetermined distance in the axial direction of the first spindle from the first cutting blade, and which performs the circumferential processing on the workpiece held by the chuck table. <P>COPYRIGHT: (C)2012,JPO&INPIT |
