| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor package in which a shape of an opening part of a bonding resin layer scarcely deforms even if bonding pressure is increased when pressure bonding a device substrate and a cap substrate thereby inhibiting quality deterioration due to the deformation. <P>SOLUTION: The semiconductor package 1A(1) comprises a first substrate 10 on which a functional device 2 having a functional region is provided on one face side, a bonding resin layer 30 disposed on the one face of the first substrate 10 and having an opening part formed so as to expose the functional region of the functional device 2, and a second substrate 20 bonded with the first substrate 10 via the bonding resin layer 30. The opening part has a shape, viewed from a layered direction of the first substrate 10 and the second substrate 20, surrounded by a plurality of straight lines and/or curved lines, in which an angle between two adjacent straight lines or an angle between a straight line and a tangent line of a curved line adjacent to the straight line is an obtuse angle. <P>COPYRIGHT: (C)2012,JPO&INPIT |
