| 摘要 |
A method of manufacturing a woven mesh substrate with semiconductors (1), which embeds a plurality of globular semiconductor elements (3), having either a light-receiving or a light-emitting function, in a mesh-shaped woven substrate (2) having a plurality of insulating wires (21) being vertical threads and a plurality of conducting wires (22) being horizontal threads, comprises the steps of: forming gaps by using a heddle mechanism (53) to make a first vertical thread group (21a), including a plurality of vertical threads, and a second vertical thread group (21b), including a plurality of vertical threads positioned parallel to, and alternating with, the first vertical thread group, move up and down; using a shuttle mechanism (54) to supply the horizontal threads (22) into the gaps between the first and second vertical thread groups, and beating the horizontal threads (22) with a reed mechanism (55); coating, with a conductive binder (49), a plurality of regions of the beaten horizontal threads which correspond to either some or all of the openings in the mesh; and embedding the plurality of globular semiconductor elements (3) corresponding to either some or all of the plurality of regions which have been coated with the first conductive binder (49) in the preceding step, and connecting either a plurality of first electrodes (31) or second electrodes (31) respectively to the horizontal threads. |
