| 摘要 |
There is provided a thermal processing apparatus in which the outer shell of a vacuum insulation layer-forming structure has an increased buckling strength. The thermal processing apparatus 1 includes a cylindrical reaction tube 3, a boat 5 for holding wafers W, a heater 2 provided around the reaction tube 3, and a vacuum insulation layer-forming structure 10 provided around the heater 2. The vacuum insulation layer-forming structure 10 includes an inner shell 11 and an outer shell 12 which forms a vacuum insulation layer 10a between the outer shell 12 and the inner shell 11. The outer shell 12 is comprised of a thin plate having an undulating cross-sectional shape formed by plastic forming. |
