| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an MEMS (micro-electromechanical system) sensor in which a frame body part formed from a silicon wafer of an SOI (silicon on insulator) layer is fixed to a counter substrate while interposing a metal-bonded part between them and a protective insulation layer for covering the metal-bonded part can be formed faultlessly. <P>SOLUTION: A first metal layer 31a is formed on a counter insulation layer 22, a second metal layer 32a is formed on the frame body part 14 separated from the silicon wafer of a functional layer and the first metal layer 31a is bonded to the second metal layer 32a by eutectic bonding or diffusion bonding. A concave part 18 is formed on the frame body part 14 in a portion opposed to a projected part 31c of the first metal layer 31a and a gap part 19a is formed between the projected part 31c and the bottom surface 18b of the concave part 18. Since the protective insulation layer 41 is deposited faultlessly on an outside part of the metal-bonded part 30a via the gap part 19a by a CVD method or the like, the corrosion of the first metal layer 31a or the second metal layer 32a can be prevented easily. <P>COPYRIGHT: (C)2012,JPO&INPIT |
