发明名称 |
Cylindrical Embedded Capacitors |
摘要 |
A device includes a substrate having a front surface and a back surface opposite the front surface. A capacitor is formed in the substrate and includes a first capacitor plate; a first insulation layer encircling the first capacitor plate; and a second capacitor plate encircling the first insulation layer. Each of the first capacitor plate, the first insulation layer, and the second capacitor plate extends from the front surface to the back surface of the substrate.
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申请公布号 |
US2012049322(A1) |
申请公布日期 |
2012.03.01 |
申请号 |
US20100873931 |
申请日期 |
2010.09.01 |
申请人 |
SU AN-JHIH;HSIEH CHI-CHUN;WANG TZU-YU;WU WEI-CHENG;HU HSIEN-PIN;HOU SHANG-YUN;CHIOU WEI-CHIH;JENG SHIN-PUU;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
SU AN-JHIH;HSIEH CHI-CHUN;WANG TZU-YU;WU WEI-CHENG;HU HSIEN-PIN;HOU SHANG-YUN;CHIOU WEI-CHIH;JENG SHIN-PUU |
分类号 |
H01L29/92;H01L21/768 |
主分类号 |
H01L29/92 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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