SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

摘要

A semiconductor device includes a wiring board, a first semiconductor chip disposed over the wiring board, a stack of second semiconductor chips disposed over the first semiconductor chip; and a first connection structure connecting the first semiconductor chip and the stack of second semiconductor chips. The first connection structure includes first and second connection electrodes disposed on the first semiconductor chip and a closest second semiconductor chip of the stack, respectively. The closest second semiconductor chip is closest to the first semiconductor chip. A bonding material bonds the first and second connection electrodes.