发明名称 FEEDBACK FOR POLISHING RATE CORRECTION IN CHEMICAL MECHANICAL POLISHING
摘要 A substrate having a plurality of zones is polished and spectra are measured. For each zone, a first linear function fits a sequence of index values associated with reference spectra that best match the measured spectra. A projected time at which a reference zone will reach the target index value is determined based on the first linear function, and for at least one adjustable zone, a polishing parameter adjustment is calculated such that the adjustable zone has closer to the target index at the projected time than without such adjustment. The adjustment is calculated based on a feedback error calculated for a previous substrate. The feedback error for a subsequent substrate is calculated based on a second linear function that fits a sequence of index values associated with reference spectra that best match spectra measured after the polishing parameter is adjusted.
申请公布号 WO2011146208(A3) 申请公布日期 2012.03.01
申请号 WO2011US33998 申请日期 2011.04.26
申请人 APPLIED MATERIALS, INC.;QIAN, JUN;GARRETSON, CHARLES C.;DHANDAPANI, SIVAKUMAR;DAVID, JEFFREY DRUE;LEE, HARRY, Q. 发明人 QIAN, JUN;GARRETSON, CHARLES C.;DHANDAPANI, SIVAKUMAR;DAVID, JEFFREY DRUE;LEE, HARRY, Q.
分类号 H01L21/304;H01L21/66 主分类号 H01L21/304
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