发明名称 PEELING APPARATUS, PEELING SYSTEM, PEELING METHOD, AND COMPUTER STORAGE MEDIUM
摘要 <p>A peeling apparatus, for peeling a superimposed substrate to obtain a substrate to be processed and a support substrate, comprises: a first holding section that is provided with a heating mechanism for heating the substrate to be processed, and that holds the substrate to be processed; a second holding section that is provided with a heating mechanism for heating the support substrate, and that holds the support substrate; and a moving mechanism that holds an outer circumference section of the second holding section and moves the same in the vertical direction, so that the support substrate held by the second holding section will peel off successively from the substrate to be processed held by the first holding section, from the outer circumference section side thereof towards the center section side thereof.</p>
申请公布号 WO2012026261(A1) 申请公布日期 2012.03.01
申请号 WO2011JP66940 申请日期 2011.07.26
申请人 TOKYO ELECTRON LIMITED;HIRAKAWA, OSAMU;YOSHITAKA, NAOTO;MATSUNAGA, MASATAKA;OKAMOTO, NORIHIKO 发明人 HIRAKAWA, OSAMU;YOSHITAKA, NAOTO;MATSUNAGA, MASATAKA;OKAMOTO, NORIHIKO
分类号 H01L21/02;H01L27/12 主分类号 H01L21/02
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