| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an imaging module and a camera, in which a light-receiving surface of an imaging element chip with a through electrode has a good flatness, and that can obtain a high quality image. <P>SOLUTION: An imaging module has: a cover member; an imaging element chip with a photodiode; and a fixing member arranged around the imaging element chip, and that fixes the cover member and the imaging element chip; and a re-wiring substrate arranged on an opposite side of a cover member side of the imaging element chip. A space surrounded by the cover member, the imaging element chip, and the fixing member is provided. The imaging element chip has a semiconductor substrate. The semiconductor substrate has a through electrode that penetrates a first main surface on the cover member side and a second main surface on an opposite side of the first main surface. The imaging module also has a connection member that connects an imaging element chip with the re-wiring substrate. The through electrode and the connection member are arranged in a fixed region corresponding to the fixing member when the imaging module is seen from the cover member side. A borderline having a thickness less than that of the semiconductor substrate in a region corresponding to the space is arranged in the fixed region. <P>COPYRIGHT: (C)2012,JPO&INPIT |
