发明名称 RESIN COMPOSITION, B-STAGE FILM, LAMINATED FILM, AND MULTILAYER SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To provide a resin composition which can easily be obtained, and can enhance the flatness of a surface when being laminated on a member having holes or irregularities on the surface. <P>SOLUTION: The resin composition includes an epoxy resin, a curing agent, and a filler. The filler has been surface-treated with a silane coupling agent having a vinyl group. The content of the filler is &ge;160 pts.wt and &le;900 pts.wt based on 100 pts.wt of the total of the epoxy resin and the curing agent. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012041510(A) 申请公布日期 2012.03.01
申请号 JP20100186493 申请日期 2010.08.23
申请人 SEKISUI CHEM CO LTD 发明人 DEGUCHI HIDEHIRO
分类号 C08G59/18;B32B15/08;B32B27/20;B32B27/26;B32B27/38;C08K3/36;C08K9/06;C08L63/00;H05K1/03;H05K3/46 主分类号 C08G59/18
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