发明名称 |
THERMALLY CONDUCTIVE FOAM PRODUCT |
摘要 |
A compressible, thermally conductive foam interface pad is adapted for emplacement between opposed heat transfer surfaces in an electronic device. One heat transfer surface can be part of a heat-generating component of the device, while the other heat transfer surface can be part of a heat sink or a circuit board. An assembly including the foam interface pad and the opposed electronic components is also provided.
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申请公布号 |
US2012048528(A1) |
申请公布日期 |
2012.03.01 |
申请号 |
US201013203785 |
申请日期 |
2010.05.05 |
申请人 |
PARKER HANNIFIN CORPORATION |
发明人 |
BERGIN JONATHAN;SANTA FE VICTORIA;SEVERANCE CHRISTOPHER;ROSA GARY |
分类号 |
F28F7/00;B32B3/24;B32B5/18;B32B27/20;C09K5/14 |
主分类号 |
F28F7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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