Hybrid Multilayer Substrate

摘要

A hybrid multilayer substrate in an electronic package. The substrate includes a first portion having m layers and a second portion having n layers such that m is less than n. The first portion has a first height and the second portion has a second height. The first height is different than the second height. In another embodiment, a surface is formed between the first portion and the second portion, and a shielding material can be applied to the surface. In a different embodiment, the hybrid multilayer substrate is manufactured for shielding a first die from a second die.