| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent a laser chip and a condenser lens from being damaged during assembly or positioning. <P>SOLUTION: Protrusions 77 are formed on a condenser lens holder 54 holding an FAC lens 32, which condenses laser light output from a laser chip 41 of a semiconductor laser 31, and a rod lens 33. The protrusions 77 contact with a mount member 52 of the semiconductor laser 31, thereby preventing the contact with the laser chip. More specifically, the pair of protrusions is provided so as to respectively contact with portions of the mount member, which are located on both sides of the laser chip so as to sandwich the laser chip. <P>COPYRIGHT: (C)2012,JPO&INPIT |
