发明名称 FLOOR COOLING/HEATING PANEL
摘要 <P>PROBLEM TO BE SOLVED: To provide a floor cooling/heating panel capable of improving floor cooling/heating efficiency and having functions of a floor. <P>SOLUTION: Meandering grooves for guiding fluid without obstructing fluid flow are formed on a lower plate, weirs capable of resisting against load application are formed between the grooves and a structure for curving a bottom is formed on the bottom of each meandering groove to escape expansion pressure. Caps each of which joins and stores a plurality of flanges into a cap body to secure inflow and outflow of fluid are joined with both right and left ends of the lower plate, respectively, an upper plane plate is superposed to the lower plate to which the cap bodies are joined, and the outer peripheral parts of both the plates are joined with each other to function as a floor material. Since cooling/heating is directly performed by a panel plane, heat can be efficiently transmitted and cooling/heating can be improved. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012042188(A) 申请公布日期 2012.03.01
申请号 JP20100201372 申请日期 2010.08.23
申请人 IZUMI SHOJI:KK 发明人 SHIMOTE TOSHIYUKI
分类号 F24D3/16 主分类号 F24D3/16
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