| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce stress which is generated when a probe is brought into contact with a device to be tested. <P>SOLUTION: The present invention relates to a vertical type probe 10A for a semiconductor device including a lower contact 20 and an upper contact 11. The lower contact 20 includes a plurality of first wavelet springs 21 in which wave vertices are overlapped while being opposed to each other, and is disposed in contact with a device 70 to be tested. The first wavelet springs 21 are disposed to provide longitudinal movement, and therefore stress is reduced which is generated when the probe 10A is brought into contact with the device 70 to be tested. The upper contact 11 is overlapped on the lower contact 20 so as to form a straight line substantially, and has a width wider than that of the lower contact 20. <P>COPYRIGHT: (C)2012,JPO&INPIT |
