| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a transfer line joint for a low-temperature application device in which pressure rise inside helium gas piping can be released according to a simple method without deteriorating a cooling performance of the low-temperature application device. <P>SOLUTION: The present invention relates to a transfer line joint for a low-temperature application device which internally has piping for transferring a low-temperature gas and maintains an interval between an inner pipe and an outer pipe in a vacuum 10 in a double pipe structure of piping to suppress penetration of heat from the outside to the inner pipe. The transfer line joint has a connection structure connected by fitting a guide part 34 and a nipple part 35 to each other, the fitting portion includes a gas release duct connecting the both while having such a predetermined length as to make a temperature gradient smooth between a temperature of the inner pipe and an external temperature, and a safety valve 63 is provided in an exit part of the gas release duct to the outside. <P>COPYRIGHT: (C)2012,JPO&INPIT |
