| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a curable composition which can provide a cured product having high heat dissipation characteristics, and excellent heat resistance and light resistance. <P>SOLUTION: The curable composition is used for adhering a heat conductor 2 having thermal conductivity of ≥10 W/m-K to an electroconductive layer 4 when a chip-on-board optical semiconductor device 1 is obtained in which an optical semiconductor element 5 is directly mounted on the electroconductive layer 4 of a board having the heat conductor 2 and the electroconductive layer 4 instead of using a package. The curable composition includes a curable compound, a curing agent, and a filler having thermal conductivity of ≥10 W/m-K. The curable compound includes a polyfunctional epoxy compound having an alicyclic epoxy group. <P>COPYRIGHT: (C)2012,JPO&INPIT |
